Glancing angle XAFS and X-ray reflectivity study of Cu thermal vibration amplitudes at the CuAl2O3 interface

Abstract

Results from polarization- and temperature-dependent glancing angle XAFS and X-ray reflectivity studies on the Cu/Al2O3 thin film system indicate that Cu thermal vibration amplitudes are larger along the perpendicular than those parallel to the interface. The anisotropy was found to increase with temperature and decrease with depth in the Cu film. The kinetics leading to greater thermal disorder at the interface are found to be similar to those at the Cu surface.

Department(s)

Physics, Astronomy, and Materials Science

Document Type

Article

DOI

https://doi.org/10.1016/0921-4526(94)00710-D

Publication Date

3-1-1995

Journal Title

Physica B: Physics of Condensed Matter

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