Observation of anisotropy in CuCu atom vibrational amplitudes due to thermal motion at a CuAl2O3 interface

Abstract

Results from polarization-dependent total-reflection X-ray absorption fine structure (XAFS) and X-ray reflectivity studies on the Cu Al2O3 thin film system indicate that vibrational amplitudes of Cu atoms due to thermal motion in the direction perpendicular to the interface are substantially larger than those in the direction parallel to the interface. The anisotropy in CuCu atom vibrational amplitudes was found to increase with temperature and decrease with depth in the copper film. The kinetics leading to greater thermal disorder at the Cu Al2O3 interface and the copper surface are found to be similar up to 525 K.

Department(s)

Physics, Astronomy, and Materials Science

Document Type

Article

DOI

https://doi.org/10.1016/0375-9601(95)00314-S

Publication Date

6-19-1995

Journal Title

Physics Letters A

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